- PVA TePla Taiwan
- Applications
- Overview Applications Scanning Acoustic Microscopy
- Application Scanning Acoustic Microscopy
SAM Applications / Specific & Future-Oriented
With our ultrasound inspection systems, we support companies and research facilities in virtually all processes—from material testing to error inspection all the way to production monitoring and quality assurance. By focusing on all key areas of technology, we can offer suitable and future-proof solutions for each of them.
Power & Energy
Automotive
Semiconductor
Materials
Biology & Medical
Test Scan
Send us your sample for a free test scan
or an image analysis and see for yourself the
capabilities of non-destructive acoustic microscopy.
Power & Energy
The decline in combustion engines and the simultaneous rise in demand for renewable energies calls for greater flexibility in the energy sector. The process of feeding renewable energies into the electricity grid via transformers synchronized with the mains requires reliable power electronics for controlling electric drive concepts on a large scale.
Our systems enable you to check:
- IGBT modules
- Heat sink solutions
- Thin film layers (soldered layers & sintered layers)
- Semiconductor layers (photovoltaics, transistors, diodes)
- Metalization
Learn more about our Technology
Automotive
Non-destructive, hundred-percent testing is widely used, particularly for safety-relevant assemblies in automotive applications. Apart from this comprehensive inspection, there are demanding quality requirements and associated intensive component tests. The nascent trend for electric mobility is seeing cars, ICEs, and high-speed trains equipped with new assemblies, technologies, and power electronics—all of which must also meet these high quality standards.
Our systems enable you to check:
- Compound materials
- Power electronics
- Sensors
- Control devices
- All types of seals
- Welded connections
- Soldered layers
- Sintered layers
Learn more about our Technology
Semiconductor
The possibility of mapping the structure of every sample in a non-destructive manner to detect their structure and connection errors makes our systems important aids in all production processes—not just in the field of semiconductor technology. The areas of application are diverse and range from the front end to the back end.
Our systems enable you to check:
- Wafers and bonded wafers
- SiC ingots and wafers
- Si ingots
- MEMS
- Die structures
- Stach dies
- Microprocessors
- LED Technology
- Flip Chips
- Power electronics
- Bonded Interfaces
- CMOS Image Sensors
- Molded Components
- Passive Components (Resistors, Capacitors)
- Packaging
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Materials
Flawless basic materials are the key to flawless products. Cracks, cavities, detachment, or inclusions result in failures during the subsequent production process, which can be avoided with the help of reliable material analysis:
Our systems enable you to check:
- Hybrid components
- Glass
- Ceramic
- Semiconductor materials
- Hard metals
- Plastics (bonded and molded)
- Foodstuffs
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Biology & Medical
Thanks to non-destructive acoustic microscopy, structures lying below the surface can be made visible without the need for pretreatment such as dying, drying or embedding living cells. This provides a non-invasive method of obtaining information about the inside of a sample and laying the foundation for maximum reliability and quality. Our long-standing cooperation with the research facilities of the Fraunhofer Society and the IMEC allows us to continuously develop our technologies in these highly specialized subject areas.
Our systems enable you to check:
- Implants
- Bones
- Tissue
- Cells
- Thrombus formation
- Teeth
Learn more about our Technology